Congratulations to FlexTech Alliance for receiving a $75 million Department of Defense award to establish and manage a Manufacturing Innovation Institute (MII) for Flexible Hybrid Electronics (FHE MII). The new institute is part of the National Network for Manufacturing Innovation program (NNMI), an initiative of the Obama Administration to support advanced manufacturing in the U.S.
As Chairman of the Board of FlexTech and a longtime member of the organization, I have seen first-hand how the Alliance has built a successful track record of facilitating collaboration and advancing technologies from R&D to commercialization.
The new Institute, guided by FlexTech, will impact markets beyond defense. Developing an infrastructure for flexible electronics will spur growth in other industries that benefit from electronics that are fabricated on a thin and flexible form factor.
Flexible electronics are already re-shaping multiple markets. For example, we’ve been experiencing increased demand for flexible electronic labels that dynamically sense temperature excursions and help preserve perishable medicine or foods. We also see tremendous interest in wireless NFC tags that allow consumers to communicate with products and help connect the physical and digital worlds.